How we bring creativity and innovation to life.

• Design and develop high-performance GaN Power Amplifiers
• Incorporate best amplifier class and design topology to satisfy power, bandwidth, thermal, linearity and efficiency requirements.
• Build the company product catalog by identifying new opportunities.
• Provide technical guidance to support sales and applications.
• Offer mentorship to junior level engineers.

• 6+ years of RF/Microwave product development
• Design of efficiency enhanced Doherty Power Amplifiers
• RF Power amplifier matching and optimization
• Manual RF test with: Network Analyzers, Spectrum Analyzers, RF Signal Generators, and Oscilloscopes

• Solid understanding of Gan, pHEMT, HEMT, and HBT device physics
• Circuit Design, simulation, and layout using ADS or Cadence
• EM simulation using Momentum, FEM, and/or HFSS
• Thermal management of packaged integrated circuit

• Bachelor of Science in: Electrical Engineering

Design Team Interface

• Engage with RF IC designers early in each program to select package type, pad/bump layout, and bond strategy that meet RF, thermal, and cost targets.
• Own bonding diagrams, package outline selection, and assembly drawings for each new prototype.
• Advise designers on package parasitics (bond wire inductance, lead frame and substrate effects, ground paths).
• Translate lessons from each build back into design rules and packaging guidelines for the design team.

OSAT Interface

• Serve as the primary technical contact with OSAT partners for all assemblies.
• Prepare and release complete build packages: bonding diagrams, BOMs, wafer maps, marking, tape-and-reel requirements, and special instructions.
• Review and approve OSAT engineering deliverables, including substrate and lead frame drawings, wire bond simulations, and first-article reports.
• Lead technical calls to resolve assembly issues and drive yield improvement.

Prototype Build Management

• Plan and track prototype builds from wafer ship to sample delivery, holding OSATs and internal teams to committed dates.
• Run multiple concurrent prototype programs across QFN, DFN, Air-cavity, WLCSP, flip-chip, and laminate module packages.

Package Development & Continuous Improvement

• Evaluate new package platforms, materials, and processes to extend our catalog, including laminate SiP and multi-die modules.
• Drive 8D corrective actions with OSATs when assembly defects occur.

Transfer to Production & Qualification

• Support package and reliability qualification (MSL, HAST/THB, temperature cycling, HTOL) in partnership with quality engineering.
• Transition validated prototype assemblies to production-ready processes, documentation, and controls at the OSAT.
• Maintain accurate records in document control for every assembly configuration.

• 7+ years of semiconductor packaging or assembly engineering experience
• Experience working with OSATs on new product builds is desired, including build package preparation and first-article disposition.
• Hands-on knowledge of wire bond, die attach, molding, singulation, and tape-and-reel processes.
• Experience with lead frame packages (QFN/DFN) and at least one advanced format (flip-chip, WLCSP, or laminate substrate).
• Working knowledge of how packaging affects RF performance: parasitics, grounding, and thermal paths.
• Proficiency with bonding diagram and package drawing tools
• Familiarity with JEDEC package and reliability standards.
• Strong written and verbal communication; able to explain tradeoffs clearly to designers, OSATs, and management.

• Experience at a fabless RF, MMIC, or mixed-signal semiconductor company.
• Packaging experience with GaAs, GaN, SiGe, or SOI RF devices.
• Laminate substrate or SiP module design experience, including substrate layout review.
• Familiarity with AEC-Q100/Q104 automotive qualification requirements.
• Six Sigma, DOE, or statistical process control training.

• Bridge builder: earns the trust of both designers and OSAT engineers and gets them to agreement quickly.
• Schedule owner: treats prototype dates as commitments and escalates early when they are at risk.
• Hands-on problem solver: comfortable at the microscope, in the lab, or on the factory floor.
• Speed with discipline: moves many designs in parallel without cutting corners on documentation or quality.
• Clear communicator: writes build instructions and reports that leave no room for misinterpretation.

• BS in Electrical, Mechanical, Materials, or Manufacturing Engineering, or a related field.