How we bring creativity and innovation to life.

Applications Engineering Leadership

• Lead and manage day-to-day Applications Engineering activities, establishing priorities and ensuring timely completion of technical projects and customer deliverables.
• Provide technical guidance, mentoring, and support to Applications Engineering team members.
• Develop and improve engineering processes, project tracking, and resource allocation to enhance team productivity.
• Maintain and optimize laboratory equipment, test benches, measurement systems, and engineering software.

Customer and Technical Support

• Provide advanced technical support to existing and prospective customers regarding RF semiconductor products and applications.
• Partner with customers to support product evaluation, design integration, troubleshooting, and performance optimization.
• Collaborate with Sales and Marketing to identify new business opportunities, support technical discussions, and help secure design wins.
• Serve as a technical escalation resource for complex customer applications and product-related challenges.

Product Development and Documentation

• Work closely with Product Development and Marketing to provide application-level feedback that influences product specifications and future product roadmaps.
• Coordinate product characterization, measurement, and data collection activities for new product introductions.
• Oversee the development, accuracy, and ongoing maintenance of product datasheets and related technical documentation.
• Support the creation of application notes, technical articles, evaluation materials, and other customer-facing engineering resources.

Cross-Functional Engineering Support

• Collaborate with Operations to optimize production test boards, improve measurement correlation, and support manufacturing test activities.
• Partner with Quality Engineering to investigate product performance concerns, perform technical evaluations, and support failure analysis activities.
• Coordinate evaluation board development, tracking, and inventory management.
• Provide engineering support for internal projects and continuous improvement initiatives involving new and existing products.

• Bachelor’s degree in electrical engineering or a closely related engineering discipline, or equivalent relevant technical experience.
• Minimum of 10 years of progressive experience in RF semiconductor Applications Engineering, RF system design, or a closely related technical field.
• Strong understanding of RF circuit design, semiconductor device characterization, and board-level performance optimization.
• Experience with RF laboratory equipment, measurement techniques, and engineering test methodologies.
• Familiarity with RF circuit simulation and design tools, such as Keysight Advanced Design System (ADS).
• Demonstrated ability to troubleshoot complex technical issues and communicate solutions effectively.
• Strong organizational, project management, and cross-functional collaboration skills.
• Excellent written and verbal communication skills, including the ability to work directly with customers and internal stakeholders.

• Previous experience leading or managing an Applications Engineering team.
• Extensive experience collaborating with Quality, Operations, and Product Development teams within the semiconductor industry.
• Hands-on experience with production test board optimization, correlation, and failure analysis.
• Experience developing technical datasheets, application notes, and product evaluation materials.
• Demonstrated success supporting customer design wins and new product introductions.
• Experience managing engineering laboratories, test resources, and multiple technical projects.

The successful candidate will:

• Build and maintain a responsive, technically strong Applications Engineering function.
• Deliver high-quality technical support that strengthens customer relationships and supports revenue growth.
• Improve engineering efficiency through effective project management and laboratory optimization.
• Ensure timely, accurate product documentation and technical readiness for new product introductions.
• Strengthen collaboration between Applications Engineering, Sales, Marketing, Quality, Operations, and Product Development.

At Guerrilla RF, you will have the opportunity to make a meaningful impact within a growing RF semiconductor organization. This is a highly visible leadership position offering direct involvement in technical strategy, customer success, product innovation, and operational improvements.

We offer a collaborative, fast-paced environment where technical expertise, innovation, accountability, and teamwork are valued.

Production Testing and Equipment Operation

• Run final testing of packaged RF MMICs and modules on ATE, including loading programs, processing lots, and dispositioning test results.
• Set up, change over, and operate device handlers, including contactors, load boards, kits, and tape-and-reel or tray handling.

Troubleshooting and Preventive Maintenance

• Troubleshoot handler jams, socket and contact issues, and tester or fixture failures to restore equipment to production promptly.
• Perform routine calibration, verification, and preventive maintenance, including golden-unit correlation checks.

Quality, Yield, and Engineering Support

• Monitor yield and bin trends and escalate drift to Test and Product Engineering with clear supporting data.
• Maintain lot traceability and production records in accordance with ESD, MSL, quality, and safety procedures.
• Support new product introduction (NPI) test debugging in collaboration with engineering teams.

• High school diploma plus an associate degree in electronics or a related field, or equivalent hands-on experience.
• At least 2 years of experience in production test, semiconductor manufacturing, or electronics manufacturing.
• Working knowledge of RF measurements and concepts, including gain, return loss, noise figure, P1dB, IP3, and S-parameters.
• Hands-on experience with RF bench instrumentation, including spectrum analyzers, network analyzers, and signal generators.

• Experience with RF automated test systems and device handlers, including equipment changeovers, contactors, and jam or fault troubleshooting.

The successful candidate will:

• Maintain dependable final production test operations and timely equipment recovery.
• Support consistent test yield, accurate data, and prevention of quality escapes.
• Follow traceability, quality, ESD, MSL, and safety requirements.
• Partner effectively with Test, Product, and Quality Engineering to resolve production issues.

At Guerrilla RF, you will work directly with advanced RF semiconductor products in a collaborative, hands-on environment where technical expertise, reliability, accountability, and teamwork are valued.

• Design and develop high-performance GaN Power Amplifiers
• Incorporate best amplifier class and design topology to satisfy power, bandwidth, thermal, linearity and efficiency requirements.
• Build the company product catalog by identifying new opportunities.
• Provide technical guidance to support sales and applications.
• Offer mentorship to junior level engineers.

• 6+ years of RF/Microwave product development
• Design of efficiency enhanced Doherty Power Amplifiers
• RF Power amplifier matching and optimization
• Manual RF test with: Network Analyzers, Spectrum Analyzers, RF Signal Generators, and Oscilloscopes

• Solid understanding of Gan, pHEMT, HEMT, and HBT device physics
• Circuit Design, simulation, and layout using ADS or Cadence
• EM simulation using Momentum, FEM, and/or HFSS
• Thermal management of packaged integrated circuit

• Bachelor of Science in: Electrical Engineering

Design Team Interface

• Engage with RF IC designers early in each program to select package type, pad/bump layout, and bond strategy that meet RF, thermal, and cost targets.
• Own bonding diagrams, package outline selection, and assembly drawings for each new prototype.
• Advise designers on package parasitics (bond wire inductance, lead frame and substrate effects, ground paths).
• Translate lessons from each build back into design rules and packaging guidelines for the design team.

OSAT Interface

• Serve as the primary technical contact with OSAT partners for all assemblies.
• Prepare and release complete build packages: bonding diagrams, BOMs, wafer maps, marking, tape-and-reel requirements, and special instructions.
• Review and approve OSAT engineering deliverables, including substrate and lead frame drawings, wire bond simulations, and first-article reports.
• Lead technical calls to resolve assembly issues and drive yield improvement.

Prototype Build Management

• Plan and track prototype builds from wafer ship to sample delivery, holding OSATs and internal teams to committed dates.
• Run multiple concurrent prototype programs across QFN, DFN, Air-cavity, WLCSP, flip-chip, and laminate module packages.

Package Development & Continuous Improvement

• Evaluate new package platforms, materials, and processes to extend our catalog, including laminate SiP and multi-die modules.
• Drive 8D corrective actions with OSATs when assembly defects occur.

Transfer to Production & Qualification

• Support package and reliability qualification (MSL, HAST/THB, temperature cycling, HTOL) in partnership with quality engineering.
• Transition validated prototype assemblies to production-ready processes, documentation, and controls at the OSAT.
• Maintain accurate records in document control for every assembly configuration.

• 7+ years of semiconductor packaging or assembly engineering experience
• Experience working with OSATs on new product builds is desired, including build package preparation and first-article disposition.
• Hands-on knowledge of wire bond, die attach, molding, singulation, and tape-and-reel processes.
• Experience with lead frame packages (QFN/DFN) and at least one advanced format (flip-chip, WLCSP, or laminate substrate).
• Working knowledge of how packaging affects RF performance: parasitics, grounding, and thermal paths.
• Proficiency with bonding diagram and package drawing tools
• Familiarity with JEDEC package and reliability standards.
• Strong written and verbal communication; able to explain tradeoffs clearly to designers, OSATs, and management.

• Experience at a fabless RF, MMIC, or mixed-signal semiconductor company.
• Packaging experience with GaAs, GaN, SiGe, or SOI RF devices.
• Laminate substrate or SiP module design experience, including substrate layout review.
• Familiarity with AEC-Q100/Q104 automotive qualification requirements.
• Six Sigma, DOE, or statistical process control training.

• Bridge builder: earns the trust of both designers and OSAT engineers and gets them to agreement quickly.
• Schedule owner: treats prototype dates as commitments and escalates early when they are at risk.
• Hands-on problem solver: comfortable at the microscope, in the lab, or on the factory floor.
• Speed with discipline: moves many designs in parallel without cutting corners on documentation or quality.
• Clear communicator: writes build instructions and reports that leave no room for misinterpretation.

• BS in Electrical, Mechanical, Materials, or Manufacturing Engineering, or a related field.